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Makes semiconductor packaging materials (epoxy molding compounds, electronic adhesives) used in chip and LED packaging.
Makes semiconductor packaging materials (epoxy molding compounds, electronic adhesives) used in chip and LED packaging.
In one line: A Chinese packaging-materials maker, similar niche to Sumitomo Bakelite/Nagase.
Moat: narrow (process know-how, customer qualification). Packaging material formulations are qualified per customer process; a competitive materials niche.
Headquarters: Lianyungang, China · Founded: 2010 · Employees: 971
Size Jiangsu HHCK Advanced Materials (688535.SS) is a China Information Technology company (Semiconductors) with a market value of $1.58B, the 1564th largest of 4,839 China companies the cockpit tracks. Shares closed at CN¥73.60 on 6 Nov 2026.
Performance Over six months the shares fell 18.7%, against -16.6% for the median peer and -16.4% for the China market (cap-weighted) — 10th lowest of 20 in its peer set.
Growth Revenue grew 153.6% over the last twelve months (peer median +15.8%); the operating margin is 7.5% (peer median 5.9%).
Valuation It trades at 134.5× forward earnings against a peer median of 17.2× (2nd most expensive of 13).
Capital Return on invested capital runs 12.8 points below its cost of capital (16.9% WACC).
Next results Next results expected around 6 Apr 2027 (exchange calendar; dates can move).
| TTM | FY2025 | FY2024 | FY2023 | FY2022 | |
|---|---|---|---|---|---|
| Revenue | CN¥941M | CN¥458M | CN¥332M | CN¥283M | CN¥303M |
| Revenue growth | — | +38% | +17% | -7% | — |
| Gross profit | CN¥313M | CN¥106M | CN¥78.4M | CN¥72.3M | n/a |
| EBITDA | n/a | CN¥31.3M | CN¥36.7M | CN¥27.0M | n/a |
| Net income | CN¥82.5M | CN¥24.3M | CN¥40.1M | CN¥31.6M | CN¥41.2M |
| Free cash flow | -CN¥15.4M | -CN¥38.3M | -CN¥63.2M | -CN¥39.9M | n/a |
| Capital expenditure | CN¥81.7M | CN¥46.0M | CN¥66.2M | CN¥71.5M | CN¥0 |
| Total debt | CN¥458M | CN¥740M | CN¥259M | CN¥52.1M | n/a |
The default views of Competitor Analysis ▸ Charts, drawn from the same data. Open them in the cockpit to change the axes, pin companies and read every value.
| Company | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g |
|---|---|---|---|---|---|---|
| Jiangsu HHCK Advanced Materials 688535.SS | $1.58B | -19% | +154% | 7% | 134.5× | n/a |
| Sumitomo Bakelite 4203.T | $3.31B | +15% | +15% | 13% | 14.9× | 6.8% |
| Nagase & 8012.T | $2.96B | -9% | +8% | 5% | 10.9× | 3.5% |
| Tianshui Huatian Technology 002185.SZ | $7.74B | +10% | +33% | 4% | 45.0× | n/a |
| Hefei Chipmore Technology 688352.SS | $2.45B | +7% | -1% | 7% | 53.1× | n/a |
Peer set: Industry: the same industry and sector in any market, nearest in size. This is the same default set the interactive Competitor Analysis opens with.
| Measure | 688535.SS | Peer median | Rank in peer set |
|---|---|---|---|
| 1-month return | -19.4% | -18.0% | 8th lowest of 20 |
| 6-month return | -18.7% | -16.6% | 10th lowest of 20 |
| Distance from 52-week high | -63.2% | -45.7% | 4th lowest of 21 |
| Revenue growth (TTM) | +153.6% | +15.8% | highest of 21 |
| Operating margin | 7.5% | 5.9% | 10th highest of 21 |
| Forward P/E | 134.5× | 17.2× | 2nd most expensive of 13 |
| ROIC minus cost of capital | -12.8 pp | -4.5 pp | 4th lowest of 21 |
| Company | Market | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g | Delivered g |
|---|---|---|---|---|---|---|---|---|
| Jiangsu HHCK Advanced Materials 688535.SS | China | $1.58B | -19% | +154% | 7% | 134.5× | n/a | n/a |
| Cosmo Electronics 2466.TW | Taiwan | $1.57B | +449% | -19% | -20% | n/a | n/a | n/a |
| Wonik 030530.KS | South Korea | $1.59B | -14% | -14% | 1% | n/a | n/a | n/a |
| Taiwan Surface Mounting Technology 6278.TW | Taiwan | $1.60B | -2% | +5% | 7% | 16.1× | 6.5% | +3.8% |
| Silex Microsystems SILEX.ST | Sweden | $1.55B | -32% | +13% | 26% | n/a | 38.0% | +13.0% |
| NSING Technologies 300077.SZ | China | $1.61B | -32% | +47% | 1% | n/a | n/a | n/a |
| Thinkon Semiconductor Jinzhou 688233.SS | China | $1.62B | -11% | +12% | 18% | 59.7× | 44.7% | +18.0% |
| Tekscend Photomask 429A.T | Japan | $1.64B | -36% | +10% | 22% | 9.9× | 6.4% | +8.7% |
| Aerospace Nanhu Electronic Information Technology 688552.SS | China | $1.64B | -19% | +19% | -6% | 231.3× | 35.8% | +1.0% |
| Shenzhen Injoinic Technology 688209.SS | China | $1.64B | +5% | +13% | 11% | n/a | n/a | n/a |
| Beijing ESWIN Computing Technology 1256.HK | Hong Kong | $1.50B | n/a | +20% | -57% | n/a | n/a | n/a |
| ChipMOS Technologies 8150.TW | Taiwan | $1.49B | -17% | +19% | 8% | 12.2× | n/a | n/a |
| Shanghai Anlogic Infotech 688107.SS | China | $1.67B | -26% | +70% | -25% | n/a | n/a | n/a |
| Greatek Electronics 2441.TW | Taiwan | $1.68B | +4% | +24% | 21% | 13.2× | 1.6% | +2.7% |
| C Sun Mfg 2467.TW | Taiwan | $1.48B | -47% | +72% | 22% | 13.2× | 12.7% | +8.4% |
| Shoals Technologies SHLS | United States | $1.70B | +14% | +49% | 11% | 18.3× | n/a | n/a |
| Risen Energy 300118.SZ | China | $1.71B | -42% | -52% | -39% | n/a | 38.4% | -4.7% |
| Sensirion SENS.SW | Switzerland | $1.46B | +3% | +1% | 12% | 35.3× | 10.4% | +6.2% |
| Changzhou Fusion New Material 688503.SS | China | $1.71B | -53% | +41% | 2% | 37.6× | n/a | n/a |
| Himax Technologies HIMX | United States | $1.45B | -51% | -8% | 5% | 19.1× | 30.3% | -1.3% |
| Kaga Electronics 8154.T | Japan | $1.42B | +6% | +24% | 4% | 7.8× | n/a | n/a |