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Taiwanese OSAT specializing in gold-bumping and chip-on-film packaging for display driver ICs.
Taiwanese OSAT specializing in gold-bumping and chip-on-film packaging for display driver ICs.
Customers send finished wafers and pay a processing fee for the bumping, packaging and testing, so it carries no chip-design or inventory risk of its own. Display driver chips for phones, TVs and monitors fill most of its capacity, so orders follow panel makers' production schedules.
In one line: A niche display-driver Amkor.
Moat: narrow (scale, customer qualification, process know-how). Leading bumping/COF capacity and qualified processes for major driver-IC customers.
Headquarters: Hsinchu, Taiwan · Founded: 1988
Size Chipbond Technology (6147.TWO) is a Taiwan Information Technology company (Semiconductors) with a market value of $3.20B, the 116th largest of 687 Taiwan companies the cockpit tracks. Shares closed at NT$142.00 on 6 Nov 2026.
Performance Over six months the shares fell 20.0%, against -25.1% for the median peer and -3.4% for the Taiwan market (cap-weighted) — 9th highest of 20 in its peer set.
Growth Revenue grew 18.5% over the last twelve months (peer median +20.7%); the operating margin is 16.7% (peer median 5.1%).
Valuation It trades at 17.2× forward earnings against a peer median of 36.2× (4th cheapest of 18).
Capital Return on invested capital runs 7.2 points below its cost of capital (12.9% WACC).
Next results Next results expected around 19 Feb 2027 (exchange calendar; dates can move).
| TTM | FY2025 | FY2024 | FY2023 | FY2022 | |
|---|---|---|---|---|---|
| Revenue | NT$25.4B | NT$21.5B | NT$20.3B | NT$20.1B | NT$24.0B |
| Revenue growth | — | +5% | +1% | -16% | — |
| Gross profit | NT$8.92B | NT$4.59B | NT$4.57B | NT$5.13B | NT$7.83B |
| EBITDA | n/a | NT$5.40B | NT$5.93B | NT$7.20B | NT$9.60B |
| Net income | NT$4.05B | NT$2.78B | NT$4.13B | NT$3.99B | NT$6.21B |
| Free cash flow | n/a | -NT$834M | NT$5.25B | NT$5.01B | NT$7.34B |
| Capital expenditure | n/a | NT$5.11B | NT$935M | NT$2.23B | NT$3.72B |
| Total debt | n/a | NT$1.61B | NT$388M | NT$1.31B | NT$3.44B |
The default views of Competitor Analysis ▸ Charts, drawn from the same data. Open them in the cockpit to change the axes, pin companies and read every value.
| Company | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g |
|---|---|---|---|---|---|---|
| Chipbond Technology 6147.TWO | $3.20B | -20% | +18% | 17% | 17.2× | n/a |
| Novatek Microelectronics 3034.TW | $9.16B | +18% | +2% | 20% | 14.1× | -4.2% |
| Himax Technologies HIMX | $1.45B | -51% | -8% | 5% | 19.1× | 30.3% |
| ChipMOS Technologies 8150.TW | $1.49B | -17% | +19% | 8% | 12.2× | n/a |
| Powertech Technology 6239.TW | $4.61B | -11% | +24% | 13% | 13.2× | n/a |
Peer set: Industry: the same industry and sector in any market, nearest in size. This is the same default set the interactive Competitor Analysis opens with.
| Measure | 6147.TWO | Peer median | Rank in peer set |
|---|---|---|---|
| 1-month return | -34.3% | -22.9% | 5th lowest of 21 |
| 6-month return | -20.0% | -25.1% | 9th highest of 20 |
| Distance from 52-week high | -54.7% | -53.9% | 9th lowest of 21 |
| Revenue growth (TTM) | +18.5% | +20.7% | 11th highest of 21 |
| Operating margin | 16.7% | 5.1% | 6th highest of 20 |
| Forward P/E | 17.2× | 36.2× | 4th cheapest of 18 |
| ROIC minus cost of capital | -7.2 pp | -5.2 pp | 9th lowest of 19 |
| Company | Market | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g | Delivered g |
|---|---|---|---|---|---|---|---|---|
| Chipbond Technology 6147.TWO | Taiwan | $3.20B | -20% | +18% | 17% | 17.2× | n/a | n/a |
| Airoha Technology 6526.TW | Taiwan | $3.16B | +5% | +10% | 6% | 25.4× | 23.8% | +16.5% |
| Shenzhen S.C New Energy Technology 300724.SZ | China | $3.12B | -36% | -67% | 8% | 24.2× | 7.6% | +30.8% |
| Shenyang Fortune Precision Equipment 688409.SS | China | $3.28B | -2% | +34% | 4% | 122.8× | n/a | n/a |
| Rorze 6323.T | Japan | $3.11B | -24% | +10% | 27% | 12.6× | 14.3% | +20.4% |
| Jiangsu JieJie Microelectronics 300623.SZ | China | $3.31B | -9% | +34% | 17% | 24.6× | 17.9% | +28.2% |
| Xintec 3374.TWO | Taiwan | $3.08B | +88% | +17% | 23% | 36.2× | n/a | n/a |
| Shanghai Awinic Technology 688798.SS | China | $3.04B | -9% | +2% | 1% | 39.5× | n/a | n/a |
| InnoScience (Suzhou) Technology 2577.HK | Hong Kong | $3.03B | -63% | +56% | -49% | n/a | n/a | n/a |
| Jiangsu X-chip Semiconductor Tech 301707.SZ | China | $3.40B | n/a | +55% | 41% | n/a | n/a | n/a |
| AP Memory Technology 6531.TW | Taiwan | $2.99B | -35% | +63% | 29% | 27.0× | 34.1% | +9.8% |
| Suzhou Everbright Photonics 688048.SS | China | $3.48B | -63% | +88% | -1% | 626.2× | n/a | n/a |
| JA Solar Technology 002459.SZ | China | $3.50B | -35% | -23% | n/a | n/a | -20.3% | +13.7% |
| Hangzhou Lion Electronics 605358.SS | China | $3.55B | -25% | +24% | -1% | 81.0× | n/a | n/a |
| Diodes DIOD | United States | $3.56B | -31% | +18% | 5% | 14.6× | 34.0% | +3.8% |
| Suzhou Novosense Microlectronics 2676.HK | Hong Kong | $3.57B | -28% | +86% | -2% | 121.4× | n/a | n/a |
| Suzhou Novosense Microelectronics 688052.SS | China | $3.60B | -15% | +77% | -2% | 209.7× | n/a | n/a |
| Linktel Technologies 301205.SZ | China | $3.60B | -39% | +54% | 3% | 281.1× | n/a | n/a |
| Nordic Semiconductor NOD.OL | Norway | $3.62B | -12% | +15% | 8% | 54.6× | n/a | n/a |
| Sino-American Silicon Products 5483.TWO | Taiwan | $2.80B | 0% | -1% | 12% | 15.8× | n/a | n/a |
| IPG Photonics IPGP | United States | $2.78B | -38% | +15% | 5% | 32.8× | 24.8% | -3.5% |