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Makes connectors, sensors and cabling used across automotive, industrial, data-center, aerospace and consumer electronics.
Makes connectors, sensors and cabling used across automotive, industrial, data-center, aerospace and consumer electronics.
Sells small, custom-engineered parts that become part of a customer's product at design time, so revenue follows production of cars, appliances, aircraft and data-center equipment and recurs while the design runs. Transportation, mainly cars, is the largest segment. It separated from Tyco in 2007 and is domiciled in Switzerland.
Moat: narrow (scale, switching costs, installed base). Deep design-in relationships and broad product breadth make TE connectors hard to displace once designed into a system.
Headquarters: Schaffhausen, Switzerland · Founded: 1941
Size TE Connectivity (TEL) is a United States Information Technology company (Semiconductors) with a market value of $59.5B, the 217th largest of 3,117 United States companies the cockpit tracks. Shares closed at $207.01 on 6 Nov 2026.
Performance Over six months the shares gained 0.8%, against -19.9% for the median peer and -1.1% for the United States market (cap-weighted) — 7th highest of 21 in its peer set.
Growth Revenue grew 15.2% over the last twelve months (peer median +25.3%); the operating margin is 21.6% (peer median 20.6%).
Valuation It trades at 15.1× forward earnings against a peer median of 25.5× (7th cheapest of 21).
Price implies For today's price to make sense, revenue must grow about 8% a year for seven years (Req g). Recent delivered growth is +6%, so the hurdle is +2 pp: the price needs faster growth than the company has been delivering — of companies that just grew 25–50% a year, 93.8% slowed down over the next four years.
Capital Return on invested capital runs 8.9 points above its cost of capital (10.1% WACC).
Credit TE Connectivity has 7 bonds outstanding ($3.48B), rated A- by the agencies and trading like A- at a weighted spread of 75 bp.
Short interest Short interest is 2.1% of the free float (15 Oct 2026).
Next results Next results expected around 27 Jan 2027 (exchange calendar; dates can move).
| TTM | FY2026 | FY2025 | FY2024 | FY2023 | |
|---|---|---|---|---|---|
| Revenue | $19.9B | $19.9B | $17.3B | $15.8B | $16.0B |
| Revenue growth | — | +15% | +9% | -1% | — |
| Gross profit | $7.36B | $7.21B | $5.89B | $5.32B | $4.98B |
| EBITDA | $5.33B | $5.17B | $4.17B | $3.79B | $3.51B |
| Net income | $3.25B | $3.25B | $1.84B | $3.19B | $1.91B |
| Free cash flow | $3.40B | $3.40B | $3.20B | $2.80B | $2.40B |
| Capital expenditure | $1.12B | $1.12B | $936M | $680M | $732M |
| Total debt | $5.64B | $5.64B | $6.18B | $4.64B | $4.61B |
The default views of Competitor Analysis ▸ Charts, drawn from the same data. Open them in the cockpit to change the axes, pin companies and read every value.
| Company | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g |
|---|---|---|---|---|---|---|
| TE Connectivity TEL | $59.5B | +1% | +15% | 22% | 15.1× | 8.2% |
| Amphenol APH | $184B | +21% | +58% | 29% | 21.6× | 15.7% |
| Aptiv APTV | $7.98B | -32% | -5% | 10% | 6.8× | -6.8% |
| Luxshare Precision Industry 002475.SZ | $57.7B | -25% | +27% | 4% | 18.9× | n/a |
| Hirose Electric 6806.T | $4.23B | -4% | +21% | 22% | 17.5× | 8.4% |
| Sensata Technologies ST | $5.72B | -13% | +4% | 16% | 9.9× | 5.2% |
| Littelfuse LFUS | $9.04B | -22% | +19% | 18% | 16.3× | 15.3% |
| Lotes 3533.TW | $5.39B | -36% | +13% | 28% | 17.6× | 1.9% |
| Japan Aviation Electronics Industry 6807.T | $922M | -13% | +10% | 3% | 19.4× | n/a |
Peer set: Industry: the same industry and sector in any market, nearest in size. This is the same default set the interactive Competitor Analysis opens with.
| Measure | TEL | Peer median | Rank in peer set |
|---|---|---|---|
| 1-month return | -3.4% | -24.5% | 4th highest of 21 |
| 6-month return | +0.8% | -19.9% | 7th highest of 21 |
| Distance from 52-week high | -17.7% | -51.7% | highest of 21 |
| Revenue growth (TTM) | +15.2% | +25.3% | 5th lowest of 21 |
| Operating margin | 21.6% | 20.6% | 10th highest of 20 |
| Forward P/E | 15.1× | 25.5× | 7th cheapest of 21 |
| Growth the price implies (Req g, 7 yrs) | 8.2% | 30.2% | 3rd least demanding of 14 |
| Growth delivered (Del g) | +5.9% | +11.3% | 4th lowest of 14 |
| Hurdle (Req g minus delivered) | +2.2 pp | +12.6 pp | 5th least demanding of 14 |
| ROIC minus cost of capital | +8.9 pp | -0.9 pp | 7th highest of 20 |
| EV / EBITDA | 11.9× | 16.8× | 4th cheapest of 15 |
| Net debt / EBITDA | 0.7× | 0.4× | 7th most indebted of 15 |
| Bond spread | 75 bp | 96 bp | tightest of 6 |
| Company | Market | Market cap | 6M return | Revenue growth | Op. margin | Forward P/E | Req g | Delivered g |
|---|---|---|---|---|---|---|---|---|
| TE Connectivity TEL | United States | $59.5B | +1% | +15% | 22% | 15.1× | 8.2% | +5.9% |
| Monolithic Power Systems MPWR | United States | $58.1B | -26% | +40% | 30% | 28.3× | 39.6% | +27.0% |
| NXP Semiconductors NXPI | United States | $62.6B | -15% | +15% | 30% | 14.1× | 16.3% | +7.3% |
| Infineon Technologies IFX.DE | Germany | $66.8B | -33% | +6% | 13% | 26.0× | 30.2% | +11.3% |
| Ase Technology 3711.TW | Taiwan | $70.4B | +2% | +25% | 11% | 17.3× | n/a | n/a |
| SamsungElecMech 009150.KS | South Korea | $47.2B | +5% | +22% | 12% | 38.7× | 42.8% | +7.9% |
| Cambricon Technologies 688256.SS | China | $75.7B | -30% | +104% | 33% | 87.3× | n/a | n/a |
| SMIC 0981.HK | Hong Kong | $76.7B | -41% | +20% | 9% | 32.9× | n/a | n/a |
| Zhongji Innolight 300308.SZ | China | $79.4B | -48% | +162% | 41% | 15.4× | 23.2% | +40.3% |
| Kioxia 285A.T | Japan | $88.9B | +139% | +265% | 70% | 2.5× | -3.0% | +18.8% |
| Coherent COHR | United States | $38.0B | -42% | +23% | 14% | 16.6× | n/a | n/a |
| STMicroelectronics STMPA.PA | France | $37.7B | -32% | +10% | 7% | 31.4× | 34.0% | +3.1% |
| Nanya Technology 2408.TW | Taiwan | $35.8B | +34% | +586% | 71% | 2.9× | 0.6% | +1.8% |
| United Micro Electronics 2303.TW | Taiwan | $34.9B | +11% | +13% | 21% | 13.7× | 14.2% | +6.1% |
| Astera Labs ALAB | United States | $33.1B | -5% | +115% | 26% | 28.0× | n/a | n/a |
| Microchip Technology MCHP | United States | $31.7B | -41% | +21% | 16% | 14.5× | 34.2% | -2.8% |
| MetaX Integrated Circuits (Shanghai) 688802.SS | China | $29.5B | -35% | +84% | n/a | 469.5× | n/a | n/a |
| Marvell Technology MRVL | United States | $124B | -17% | +31% | 17% | 25.0× | 54.4% | +22.5% |
| Renesas Electronics 6723.T | Japan | $27.9B | -23% | +26% | 24% | 9.9× | 12.2% | +13.0% |
| Hua Hong Grace Semiconductor 688347.SS | China | $25.5B | +23% | +18% | -2% | 234.7× | n/a | n/a |
| Montage Technology 688008.SS | China | $25.5B | -13% | +33% | 42% | 43.7× | 39.7% | +24.5% |
TE Connectivity has 7 bonds outstanding with $3.48B face value. The agencies rate it A-; its bonds trade like A-. Weighted yield 5.48%, a spread of 75 bp over government bonds.